Decorative Plating - Copper Brightener Systems
Copper Plating produces a highly ductile deposit that can be used for a variety of applications including as a stop-off prior to heat-treating or for leveling prior to nickel plating. Acid copper plate is commonly used with a lacquer topcoat as an aesthetically pleasing final finish.
Product Name | Process | Description |
Additive 800 and Additive 810 | Cyanide Copper | A versatile copper brightener system used as a copper strike prior to other plating applications. Can also be used as a stop-off prior to case hardening operations. These proven additives can be used in sodium, potassium or mixed salt baths. |
Additive 777 Process | Acid Copper | A dye-free copper brightener system with good temperature tolerance. Provides outstanding bright deposits and exhibits excellent leveling. Produces ductile deposits that are easy to buff. |
CuChem ACD 725 Process | Acid Copper | This dye-based copper brightener system offers superior leveling and excellent low current density performance. Easy to buff. |
CuChem Roto I Process | Rotogravure | An extremely stable acid copper process providing a uniform appearance and hardness for rotogravure operations. This copper brightener system can be adjusted to control hardness. |
Explore Heatbath's broad line of Metal Cleaners for surface preparation prior to plate.
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